rev. 2.4 page 1 2009-11-10 sipmos ? power transistor ? n channel ? enhancement mode ? avalanche-rated pin 1 pin 2 pin 3 g d s type v ds i d r ds(on ) package pb-free buz 32 h 200 v 9.5 a 0.4 pg-to-220 -3 yes maximum ratings parameter symbol values unit continuous drain current t c = 29 ?c i d 9.5 a pulsed drain current t c = 25 ?c i dpuls 38 avalanche current,limited by t jmax i ar 9.5 avalanche energy,periodic limited by t jmax e ar 6.5 mj avalanche energy, single pulse i d = 9.5 a, v dd = 50 v, r gs = 25 l = 2 mh, t j = 25 ?c e as 120 gate source voltage v gs 20 v power dissipation t c = 25 ?c p tot 75 w operating temperature t j -55 ... + 150 ?c storage temperature t stg -55 ... + 150 thermal resistance, chip case r thjc 1.67 k/w thermal resistance, chip to ambient r thja 75 din humidity category, din 40 040 e iec climatic category, din iec 68-1 55 / 150 / 56 buz 32 h
buz 32 h rev. 2.4 page 2 2009-11-10 electrical characteristics, at t j = 25c, unless otherwise specified parameter symbol values unit min. typ. max. static characteristics drain- source breakdown voltage v gs = 0 v, i d = 0.25 ma, t j = 25 c v (br)dss 200 - - v gate threshold voltage v gs = v ds, i d = 1 ma v gs(th) 2.1 3 4 zero gate voltage drain current v ds = 200 v, v gs = 0 v, t j = 25 c v ds = 200 v, v gs = 0 v, t j = 125 c i dss - - 10 0.1 100 1 a gate-source leakage current v gs = 20 v, v ds = 0 v i gss - 10 100 na drain-source on-resistance v gs = 10 v, i d = 6 a r ds(on) - 0.3 0.4 w
buz 32 h rev. 2.4 page 3 2009-11-10 electrical characteristics, at t j = 25c, unless otherwise specified parameter symbol values unit min. typ. max. dynamic characteristics transconductance v ds 3 2 * i d * r ds(on)max, i d = 6 a g fs 3 4.6 - s input capacitance v gs = 0 v, v ds = 25 v, f = 1 mhz c iss - 400 530 pf output capacitance v gs = 0 v, v ds = 25 v, f = 1 mhz c oss - 85 130 reverse transfer capacitance v gs = 0 v, v ds = 25 v, f = 1 mhz c rss - 45 70 turn-on delay time v dd = 30 v, v gs = 10 v, i d = 3 a r gs = 50 w t d(on) - 10 15 ns rise time v dd = 30 v, v gs = 10 v, i d = 3 a r gs = 50 w t r - 40 60 turn-off delay time v dd = 30 v, v gs = 10 v, i d = 3 a r gs = 50 w t d(off) - 55 75 fall time v dd = 30 v, v gs = 10 v, i d = 3 a r gs = 50 w t f - 30 40
buz 32 h rev. 2.4 page 4 2009-11-10 electrical characteristics, at t j = 25c, unless otherwise specified parameter symbol values unit min. typ. max. reverse diode inverse diode continuous forward current t c = 25 c i s - - 9.5 a inverse diode direct current,pulsed t c = 25 c i sm - - 38 inverse diode forward voltage v gs = 0 v, i f = 19 a v sd - 1.4 1.7 v reverse recovery time v r = 100 v, i f = l s, d i f /d t = 100 a/s t rr - 200 - ns reverse recovery charge v r = 100 v, i f = l s, d i f /d t = 100 a/s q rr - 0.6 - c
buz 32 h rev. 2.4 page 5 2009-11-10 drain current i d = | ( t c ) parameter: v gs 3 10 v 0 20 40 60 80 100 120 c 160 t c 0 1 2 3 4 5 6 7 8 a 10 i d power dissipation p tot = | ( t c ) 0 20 40 60 80 100 120 c 160 t c 0 10 20 30 40 50 60 w 80 p tot safe operating area i d = | ( v ds ) parameter: d = 0.01 , t c = 25c -1 10 0 10 1 10 2 10 a i d 10 0 10 1 10 2 v v ds r ds(on) = v ds / i d dc 10 ms 1 ms 100 s 10 s t p = 7.6s transient thermal impedance z th jc = | ( t p ) parameter: d = t p / t -3 10 -2 10 -1 10 0 10 1 10 k/w z thjc 10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 s t p single pulse 0.01 0.02 0.05 0.10 0.20 d = 0.50
buz 32 h rev. 2.4 page 6 2009-11-10 typ. output characteristics i d = |( v ds ) parameter: t p = 80 s 0 2 4 6 8 10 12 v 16 v ds 0 2 4 6 8 10 12 14 16 18 a 22 i d v gs [v] a a 4.0 b b 4.5 c c 5.0 d d 5.5 e e 6.0 f f 6.5 g g 7.0 h h 7.5 i i 8.0 j j 9.0 k k 10.0 l p tot = 75w l 20.0 typ. drain-source on-resistance r ds (on) = |( i d ) parameter: v gs 0 4 8 12 16 a 22 i d 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 w 1.3 r ds (on) v gs [v] = a 4.0 v gs [v] = a a 4.5 b b 5.0 c c 5.5 d d 6.0 e e 6.5 f f 7.0 g g 7.5 h h 8.0 i i 9.0 j j 10.0 k k 20.0 typ. transfer characteristics i d = f ( v gs ) parameter: t p = 80 s v ds 3 2 x i d x r ds(on)max 0 1 2 3 4 5 6 7 8 v 10 v gs 0 1 2 3 4 5 6 7 8 9 10 11 a 13 i d typ. forward transconductance g fs = f ( i d ) parameter: t p = 80 s, v ds 3 2 x i d x r ds(on)max 0 2 4 6 8 a 12 i d 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 s 6.0 g fs
buz 32 h rev. 2.4 page 7 2009-11-10 gate threshold voltage v gs (th) = | ( t j ) parameter: v gs = v ds , i d = 1 ma 0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0 v 4.6 v gs(th) -60 -20 20 60 100 c 160 t j 2% typ 98% drain-source on-resistance r ds (on) = | ( t j ) parameter: i d = 6 a, v gs = 10 v -60 -20 20 60 100 c 160 t j 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 w 1.3 r ds (on) typ 98% typ. capacitances c = f ( v ds ) parameter: v gs = 0v, f = 1mhz 0 5 10 15 20 25 30 v 40 v ds -2 10 -1 10 0 10 1 10 nf c c rss c oss c iss forward characteristics of reverse diode i f = | ( v sd ) parameter: t j , t p = 80 s -1 10 0 10 1 10 2 10 a i f 0.0 0.4 0.8 1.2 1.6 2.0 2.4 v 3.0 v sd t j = 25 c typ t j = 25 c (98%) t j = 150 c typ t j = 150 c (98%)
buz 32 h rev. 2.4 page 8 2009-11-10 avalanche energy e as = | ( t j ) parameter: i d = 9.5 a, v dd = 50 v r gs = 25 w , l = 2 mh 20 40 60 80 100 120 c 160 t j 0 10 20 30 40 50 60 70 80 90 100 110 mj 130 e as typ. gate charge v gs = | ( q gate ) parameter: i d puls = 14 a 0 4 8 12 16 20 24 28 32 nc 38 q gate 0 2 4 6 8 10 12 v 16 v gs ds max v 0,8 ds max v 0,2 drain-source breakdown voltage v (br)dss = | ( t j ) -60 -20 20 60 100 c 160 t j 180 185 190 195 200 205 210 215 220 225 230 v 240 v (br)dss
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